In conclusion of advanced packaging,
we would like to summarize the main takeaways starting with pathways for
assembling and packaging technologies. We discussed trends in interconnect
scaling of microelectronic systems at the seven nanometer
scale length in silicon and beyond. During our presentation, we saw how 2D and 3D die-to-die interconnects can
enable high performance and can facilitate systematic and
modular design of multi chip packages. Turning to the future,
we estimate how co packaging optical will address the challenges of off package
bandwidth scaling in future systems. Thank you. And we will see you in the future,
so long.